Process Capabilities
Far East Resources enters no exclusive representation agreements with its vendor base, we are only limited by the capabilities of those vendors we source from. By choosing to remain a "free agent" in the industry, and not being confined by one-to-one relationship with our supplier base, we can bring any and all the advantages from any supplier in any country we have offices in.
| Base Laminates Available | FR4, CEM1, CEM3, FR2, FR1, FR5, Polyimide, BT Epoxy, Teflon |
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| Technologies Available | Rigid, Rigid-Flexible, Flexible, Backplanes, Thin Core, Blind/Buried/Microvias, Impedance Control, Hybrid Circuitry | |
| Min. Line Width/Spacing | 3/3 Mils | |
| Aspect Ratio | 10:1 | |
| Min./Max. Layer Count | 1-42 Layers (Rigid Technology); 4-10 Layers (Rigid-Flex Technology) |
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| Max. Board Size | 600mm x 760mm | |
| Min. Finished Board Thickness | 3 mils (.075mm or .002") | |
| Max. Finished Board Thickness | 7.6mm | |
| Min. Finished Hole Tolerance | Mechanical: 8 mil (.20mm or .007") |
Laser: 4 mil (.10mm or .003") |
| Max. Finished Copper Plating | 3 oz Cu | |
| Surface Finishes Available | HASL, immersion gold/tin/nickel, selective gold plating, electrolytic gold plating, OSP, Carbon Ink, Peelable Soldermask, silver through hole, SN100C, Leadfree HAC | |
- Cost Drivers for PCB's
- Online Quote Form
- Downloadable Quote Form (PCB's)
- Downloadable Quote Form (Cable Assy)